EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

Amphenol CANADA, part of the Amphenol Military Aerospace Operations (AMAO) group, is a global leader with over 50 years of experience in providing customized solutions for customers through design, manufacturing, and testing of rectangular interconnects applicable to military/aerospace and commercial applications. As a vertical integration company, we have full-scale facilities for design, manufacturing, and testing, enabling us to provide customized solutions tailored to each application. As a vertical integration company, we offer customers a competitive advantage by reducing costs through shorter lead times. We can also perform testing tailored to customer specifications.

The lightest plate carrier 4-way stretch Tweave sewn internally for comfort Poly mesh cummerbund for increased ventilation Rear internal pocket for storage Elastic webbing straps for cable management PALS webbing for MOLLE attachment Removable front flap Zipper for DS Assaulter's Zip-On Back Panels QASM buckle System Available in different shapes depends on the plate thickness Soft armor can be added Composition Material : 500D Cordura® + ARAMID / PV® Size : Small : 8.5" x 11.5" Plate Pocket Medium : 9.3" x 12.3" Plate Pocket Large : 10" x 13" Plate Pocket XLarge : 10.9" x 13.8" Plate Pocket Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)

Outposts solutions allow you to extend and run native AWS services on premises, and is available in a variety of form factors, from 1U and 2U Outposts servers to 42U Outposts racks, and multiple rack deployments. With AWS Outposts, you can run some AWS services locally and connect to a broad range of services available in the local AWS Region. Run applications and workloads on premises using familiar AWS services, tools, and APIs. Outposts supports workloads and devices requiring low latency access to on-premises systems, local data processing, data residency, and application migration with local system interdependencies.

Processor - NXP Quad Core PowerPC QorIQT2080 up to 1.8GHz - 6 DMIPS/MHz per core (up to 43,200 DMIPS@1.8GHz) - 128b AltiVecSIMD unit (up to 72 GFLOPs@1.8GHz) Memory - 4GB soldered 64-bit DDR3L SDRAM with ECC - 256MB 16-bit NOR flash - 64GB SATA NAND SSD - 512KB NvRAM Form Factor - 3U OpenVPX - Conduction-Cooled

OZVPX3-410 is Olzetek's flagship 3U product. Olzetek's 3U Platform Family has maximum scalability using Xilinx Zynq® UltraScale +MPSoC, which is capable of a high-performance Arm®-based multi-core and multi-processing system, as well as video signal/packet processing functions, graphics and video pipelines. This is a SoC product designed to meet challenging demands by offloading essential applications to dedicated processing blocks and supporting major peripherals and interfaces. The OZVPX3-410 product is an ideal solution that can be applied to applications requiring Analog Video (PAL/NTSC) encoding and decoding and includes customization options (consignment development) according to specific video inputs, requirements analysis, and design. We also provide consignment development of a complete Video 3U Platform.