Konan LLM is a Large Language Model independently developed by Konan Technology. Excelling over DeepSeek-R1 in eight categories such as writing, roleplay, reasoning, and coding, Konan LLM ENT-11 unifies generative and reasoning modes for more refined and flexible performance.

Processor - 64-bit Quad Core PowerPC QorIQT2080 up to 1.2GHz - 6 DMIPS/MHz per core (up to 28,800 DMIPS@1.2GHz) - 128b AltiVecSIMD unit (up to 38.4 GFLOPs@1.2GHz) Memory - 4GB soldered 64-bit DDR3L SDRAM with ECC - 256MB 16-bit NOR flash - 64GB SATA NAND SSD - 512KB NvRAM Form Factor - 6U VME - Conduction-Cooled, Air-cooled support

Haigh-Farr has been serving the United States Department of Defense and associated defense contractors for the last 50 years with pride. In fact, the first antenna design ever developed by Haigh-Farr was engineered for a tactical weapon meant to protect the lives of American war fighters; and a variant of that antenna is still being delivered and deployed to this day.

국내 최초로 GaN MMIC HPA 개발을 통한 레이다 탐지용 TR Module 개발로 핵심기술을 확보 하였으며 S ~ Ka대역 주파수 범위에 최적화된 다양한 제품을 개발, 생산하고 있습니다.

Honeywell 360 Display for Aviation The aviation version of the display is a wearable visor that uses augmented reality to provide civilian or military pilots with a high-resolution 360-degree view that seamlessly matches the view outside the cockpit. It also provides traffic callouts and flight instrumentation in the pilot’s field of view, which makes the Honeywell 360 Display ideal for flying at night, in bad weather or in congested airspace. The display improves safety, pilot confidence and aircraft utility. Honeywell 360 Display for Rugged Ground Vehicles Operators of ruggedized vehicles can use the display to safely maneuver in low visibility or hazardous conditions. It improves overall situational awareness, reaction speed and survivability by increasing visibility and reducing the need to consult instruments in the vehicle. The lightweight head-worn display uses real-time outside high-resolution camera feeds to create a seamless mixed-reality view and provides operators sensor information within their immediate field of view.

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

The ENS2000 (Sub-6GHz 5G small cell) is a small cell capable of providing 5G services with a coverage radius of several hundred meters. It supports operator 5G bands such as n78 (3.5GHz) and n79 (4.7GHz) for private 5G. Originally developed for indoor use, but it can also be installed in enclosures such as streetlight cabinets for outdoor deployment when needed.

The NIDV supports its members in both the national and international markets in as many ways as possible. From participation in international projects, international trade fair visits to programs with government support. You can find more information about these initiatives below. International projects The NIDV organizes various opportunities for its participants to improve their international opportunities. The NIDV facilitates international trade fair participation, matchmaking events with international Original Equipment Manufacturers (OEMs) and meetings about international opportunities. Trade fairs and trade missions Participation in trade fairs takes place in close consultation and collaboration with a number of departments. The Ministries of Foreign Affairs, Defense and Economic Affairs are involved in the activities. For the government part, the RVO is involved in the creation of the Dutch pavilion and hospitality lounge with the help of the Ministry of Economic Affairs and Climate Policy. In addition to trade fairs and trade missions, the NIDV actively participates in various international projects. Partners for International Business (PIB) Partners for International Business (PIB) is a program that allows Dutch companies to realize their international ambitions in a public-private partnership. Doing business abroad is not always easy. You may encounter trade barriers, insufficient knowledge among local governments and companies, or adverse local legislation. Collaborating with other companies in the sector and the Dutch government can ensure that you are in a stronger position. Alliance II The NIDV will participate in EU-ALLIANCE II from 2021 to 2023, this European project aims to support SMEs on the international market in the field of technical textiles, connectivity and advanced materials on “dual use” markets in four target countries , namely: United States, Canada, Japan and Indonesia.