Wing shells, side shells and fuselage sections are usually made of carbon fibre composites and glued together during the production process. With many components, a groove or an open edge remains after the bonding process, which must be filled or sealed. A modified two-component epoxy resin is often mixed and then applied manually. This often entails long production times and complex quality controls. Equally high material costs due to the processing of materials from cartridges. ViscoTec defies short pot life and materials that are difficult to handle: Thanks to a coherent overall system from material removal to material application, this process can be automated. The two components are taken separately from cartridges, hobbocks or drums and fed via hose lines to a two-component dosing system. Only at the very end of the process they are mixed in a static mixing tube and applied to the substrate (e.g. via a nozzle). The process is controlled and monitored by pressure sensors.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

We have taken the standard housing configuration of the P1 & P3 mounting dimensions while incorporating true differential pair contacts within the P1 & P3 dimensional constraints. P1 connector housing contains 21 position true differential pair blind mate contacts allowing board designers to carry high density differential pair signals from the LRU via motherboard to daughter-card plug in modules with a single connector P1 type housing.

Temperature / Flame Resistant Seals Reinforced & Non-Reinforced Seals Vulcanized Bonding Custom Technical Elastomeric Solutions

Chelton’s vehicle intercom systems are engineered to provide exceptional communication clarity and security, even in the harshest operational environments. Designed with scalability and modularity at their core, they can be tailored to fit a wide range of vehicle platforms and mission requirements. Built to withstand extreme conditions, these systems ensure uninterrupted voice and data exchange, enabling teams to stay connected and effective in the most challenging scenarios. Backed by decades of expertise and trusted by defence forces worldwide, Chelton delivers robust, future-ready solutions that enhance situational awareness and mission success.

Custom Technical Elastomeric Solutions

Side shells, wing shells and fuselage structures are made of CFK, GFK, aluminium or organic sheets and get connected during production. Sealants are used to seal the connection surfaces. These are usually two-component polysulphides, which have to be applied in different geometries. Typical applications are: Fillet sealings, oversealings, interface sealings and seal caps. Due to their properties, polysulfides require very low pressure and shear handling. The compressibility of the fillers contained in the medium requires a high level of expertise and a coherent overall system from material removal to application. With manual application, long production times and high material ejection have a negative influence on the complete process. Complex quality standards are required due to the risk of human error. With the in-house developments of the vipro-DUOMIX from ViscoTec, this process can be depicted fully automatically. The individual nozzle design is also adapted to each application. The result is a controlled dosage in compliance with the specifications and at the same time the highest repeat accuracy.

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