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Seoul ADEX 2025 Digital Directory
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Each exhibitor can add as many products and services as they wish, with in-depth information and specifications. This allows buyers to find what they want easily.
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Each exhibitor has full control of their content - to edit their company profile, upload products and enter staff details.
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Some of our latest content
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Telcom International
Ducommun
Founded in 1849, Ducommun is the oldest company in California, USA. Currently located in Carson, near Los Angeles, the company began as a hardware supply store in Los Angeles during the California Gold Rush and now designs and manufactures aerospace, RF coaxial switches, switch matrices, and millimeter-wave components. - Microwave Products (available from DC to 46GHz SPST through the SP10T range) - Switch Matrices (product design and customization to meet individual customer requirements) - Ducommun RF products cover the DC range up to 110GHz - Coaxial Switches available up to 40GHz - Low Noise / High Power RF Products - Space-Grade Products
ARS ELECTRONICS S.r.l.
RELAYS
ELECTROMECHANICAL RELAYS
Tescan Group a.s.
TESCAN Plasma FIB-SEM, SOLARIS X2
TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.
BIBUS METALS KOREA
Downloads
https://metals.bibus.com/kr-en/downloads/ Aerospace stock range Automotive Industry Certificate EN9120:2018 Declaration_RoHS-REACH-Conflict Minerals_Child_Labour EXHAUST SYSTEMS Fasteners Flyer Medical Applications Formulae for calculation General terms and conditions of purchase General terms and conditions of sale Medical Application Power Generation Stock Range Stock Program Asia and Europe Stock Range Aeropsace Thermal Processing Welding products
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Seoul ADEX 2025 Digital Directory
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디렉터리 기능
전시회 도우미
In-depth Exhibitor Profiles
Each exhibitor can add as many products and services as they wish, with in-depth information and specifications. This allows buyers to find what they want easily.
Self Provisioning for Exhibitors
Each exhibitor has full control of their content - to edit their company profile, upload products and enter staff details.
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최신 콘텐츠
기업, 상품, 뉴스, 이벤트
EMCORE
GEO-FOG 3D Dual Inertial Navigation System (INS) (Non-ITAR)
EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.
Sangdo Electronics co.,Ltd
HPD/HPF Series
The HPD/HPF PCB Connectors series is crafted with precision, integrating advanced Hypertac contact technology for dependable connectivity. With a lifespan of up to 100,000 insertion/extraction cycles, these connectors ensure consistent performance in challenging environments. They feature optimized power efficiency and strong high-current handling capabilities, enhancing system efficiency while maintaining reliability. Engineered to withstand tough conditions, these connectors offer robust connectivity solutions across various applications, promoting seamless operation, productivity, and long-term dependability for your systems.
Tescan Group a.s.
TESCAN TENSOR
Explore nanoscale structure with clarity, speed, and confidence. Tescan’s STEM solutions are purpose-built for advanced materials research, semiconductor analysis, and detailed nanoscale characterization. With integrated 4D-STEM, precession-assisted diffraction, and synchronized EDS workflows, our instruments deliver actionable insight with unmatched usability—whether you're mapping strain, analyzing phases, or accelerating failure analysis and R&D.
ElectroAir
Air Conditioning Unit
Air conditioning units are designed for efficiency, durability, and environmental control, our units help ensure smooth ground handling and turnaround operations in all weather conditions Whether servicing commercial planes or private jets, our units deliver powerful and precise cooling and heating to ensure comfort for passengers and crew.
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