Inserts are used in the aerospace industry in lightweight sandwich panels and are then bonded. The panels can then be screwed or various components can be fastened. However, the manual process has several disadvantages: Enormous expenditure of time for the manual filling of several thousand inserts, high material waste due to relaxation of the material, and high material costs through the use of cartridges. ViscoTec can map the filling process automatically. The dispensing process is absolutely precise. A significant amount of material can thus be saved. In addition, material can be supplied from large containers, which in turn lowers purchase prices. Another important advantage: As a rule, no new specifications have to be made since no changes are made to the actual process.

Shell : Silicone Rubber(Black) solderless terminal : KS D 5202, C5210R1/2H Rope : Nylon code(Black) Terminal : STS304(Black)

The SC-SBCRTM-V2 is a Rear Transition Module (RTM) designed to extend the I/O functionality of the SBC6511 single-board computer. Mounted on the rear side of the main VPX backplane, this module provides additional I/O expansion through Micro-D and D-sub connectors for synchronization signals, two Ethernet ports, two Mini-DisplayPort video outputs, two USB interfaces, and MMCX connectors. It enhances system flexibility and connectivity for embedded and radar signal-processing applications.

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

The SC-SBCRTM-V2 is a Rear Transition Module (RTM) designed to extend the I/O functionality of the SBC6511 single-board computer. Mounted on the rear side of the main VPX backplane, this module provides additional I/O expansion through Micro-D and D-sub connectors for synchronization signals, two Ethernet ports, two Mini-DisplayPort video outputs, two USB interfaces, and MMCX connectors. It enhances system flexibility and connectivity for embedded and radar signal-processing applications.

The EPNR1000 is a drone-mounted 5G base station integrating CU-DU-RU, with 5G Core and an IP-PTT application server built in. All 5G network elements are combined into a single unit, allowing standalone operation (IOPS). Mounted on a drone, it can provide line-of-sight coverage over obstacles like buildings or mountains, making it an ideal system for delivering 5G services over wide areas during disasters or military operations.

High productivity • The nodding head type spindle maximizes productivity and efficiency during multi-face and 5-axis simultaneous machining operations. High rigidity • Dual ball screws deliver improved stability and responsiveness for heavy-duty cutting. Easy chip disposal • The machines’ central chip removal system improves operational efficiencies.

FLIR's man-portable soldier solutions are lightweight, powerful, and easy to use, making today's warfighter more capable and more agile on the battlefield than ever before.