GORE® SKYFLEX® Aerospace Materials are a portfolio of unique, commercially-available material sets, forms and sizes with a wide range of engineered properties and specifications. Gore’s tapes and gaskets are specified by leading civil and defense aircraft OEMs and solve many challenges such as sealing, abrasion, corrosion and gap filling. These materials can also withstand a wide range of temperatures.

Twister is lightweight, rapidly deployable, and designed to provide actionable intelligence directly at the point of contact. Its agility and intuitive operation make it ideal for SOF units operating in contested or high-tempo environments. Key Features: Lightweight and packable <1-minute deployment Designed for small-unit autonomy Live video and metadata transmission Supports target acquisition and real-time threat detection

Highest Productivity with reliable part quality • Maximize productivity by using up to 4 lasers, advanced scanning strategies and bidirectional recoating. • Maintain reliable part quality by using uniform gas flow and precise 3-axis scanner motions. • All features are designed with minimizing the cost per part in mind to maximize your profitability. Automation of processes and minimize job to job time. • For increased operational efficiency, powder handling, powder sieving are optimized. • The job to job time is minimized by using exchangeable build containers. Best in class volume • Offering uninterrupted 24/7 series production utilizing the segment‘s largest build volume and sophisticated powder management. • This allows for printing of a wide range of mid to large size fully functional components. Easy to Print with a wide range of materials • DLX enables the production of highly precise and high-quality printed parts with a wide range of materials. • Standard materials are Aluminium, Titanium, Copper, Inconel, Maraging Steel, Stainless Steel and more.

The SC-HPCRTM is a Rear Transition Module (RTM) designed to extend the I/O functionality of the HPC2812 high-performance computing board. It can be mounted on the rear side of the VPX backplane to enhance system connectivity and I/O flexibility. Since the HPC2812 board consists of two computing nodes, the SC-HPCRTM provides dedicated interfaces for each node, including Ethernet, USB, MMCX, and Mini-HDMI ports, ensuring optimal data communication and display output performance in mission-critical embedded systems.

Features ▪ Xilinx Zynq-7000 Series ARM-Cortex-A9 Core ▪ 10/100/1000 Ethernet Interface ▪ General-Purpose Input/Output ▪ SDLC Interface ▪ RS-232 Interface ▪ VPX 3U Form Factor ▪ Wedge lock, Plug-in Design ▪ Customized Rear I/O Pin Map

Interconnect Wire Harness and Cable Assemblies are the connectivity backbone of electronic systems. Fabricated in a factory setting, build-to-print wire harness assemblies enable the OEM manufacturer to reduce the time and expense of in situ interconnection of electronic devices used in complex air, sea, land and space applications.

GP division is producing Glass paper in the wet by glass fiber fabric as a main ingredient. Glass Paper has a dimensional stability, heat resistance, chemical resistance, electrical insulation, Print Processability, heat insultion and so on. Due to its advanced quality, the Glass Paper is used by many manufacturers globally for floorings, buildings, exterior electronics. Also, it is used for inorganic filter products, and diverse parts are under researching as its demands rise up.

Maximum Control for your interactive graphical displays. Developing HMIs for safety- and mission-critical avionics and embedded displays only gets more demanding. VAPS XT offers HMI designers, systems engineers, and embedded engineers maximum control and flexibility for creating interactive real-time graphical displays for avionics and other safety-critical embedded applications. With an open architecture and integrated logic capabilities, VAPS XT provides the essential features for the design and deployment of certifiable cockpit displays. VAPS XT provides a model-based environment supporting all phases of development from initial concept to embedded deployment. Through a flexible porting structure, VAPS XT applications can be easily deployed to virtually any embedded target with excellent performance.