Spring probes provide reliable electro-mechanical performance through hundreds of thousands of cycles. They are available in a variety of sizes, spring forces and terminations. Smiths Interconnect compression mount connectors utilizing spring probe technology offer tremendous advantages in reliability, performance and efficiency in comparison to conventional technologies like stamped metal, wire mesh, pin-and-socket or elastomer. Standard spring probes offering includes battery contact and connector probes designed to optimize contact performance in high-reliability, multiple-cycle interconnect applications.

We can manufacture products that comply with MIL-PRF and MIL-STD standards, and offer radiation-hardened designs, hermetic packaging, and Class S and Class K screening services. Space Satellite Communication Providing optimized performance in space radiation environments with radiation-hardened semiconductors and hermetic packaging solutions. Deep Space & Earth Observation Ensuring long-term mission reliability with high-reliability power management ICs, RF components, and Class K screening products. Launch Vehicle Electronics Providing rugged packaging and hermetic components that withstand extreme temperatures and shocks. Defense Missile & Precision Guided Munitions Ensuring lightweight and shock-resistant performance with miniaturized, high-reliability semiconductors and customized packaging. Electronic Warfare & Radar Providing high-performance components, including high-frequency RF components, power amplifiers, and high-speed digital ICs. Avionics & Secure Communications Providing EMI/EMC-compliant circuit protection devices and highly reliable power management solutions.

A wire in military or aerospace applications is a conductor used to transmit electrical power or signals between components in aircraft, vehicles, or defense systems.

The world’s first satellite dedicated to blue carbon monitoring, launched in January 2025. Equipped with an AI-powered onboard processor, BlueBON processes electro-optical data directly in orbit, reducing latency and eliminating the need for energy-intensive ground-based processing. This establishes a new model for sustainable, application-driven EO missions.

characteristicRear wheel drive type (5 forward speeds, 1 reverse speed) Cable Remote Control Type 2nd and 3rd speed Triple Synchro applied apply2.5-ton trucks and medium-sized buses, 3.5-ton trucks and medium-sized buses

Our software enables engineers to analyze and optimize their preliminary designs in the best way possible – at the whole aircraft level – which not only saves time but money as well. With its Multi-disciplinary Analysis and Optimization (MDAO) approach, you can model aircraft and their subsystems, assess performance, and generally accelerate your progress in numerous design challenges. Whatever your aircraft preliminary design goals may be, Desmo has a solution.

Our firm offers end-to-end GaN production capabilities, including fabrication, packaging, test, and failure analysis to meet custom requirements. To enable customer designs, a process design kit (PDK) is available with a design manual, sample layouts, and a non-linear device model. Options available include fabrication of customer-designed wafers (“PDK foundry service”) or custom design by TransEON and fabrication according to customer specs (“NRE foundry service”). For either option, volume levels available include pilot/engineering runs, multi-project wafers (MPWs), or full production runs.

• Openable sleeves • Expandable sleeves • Convoluted conduits • Heat shrink tubing & sleeves • Heats shrink boots • Specific sleeves