EMCORE’s SDI170 IMU is designed as a performance-compatible inertial system that is form, fit, and functional with a legacy RLG-based IMU product, but with superior overall performance, versatility, and a significantly higher MTBF (Mean Time Before Failure) rating over ruggedized environments. The tactical performance of the SDI170 IMU is based on EMCORE’s mature, proven, dependable and accurate quartz MEMS inertial sensor technology in our SDI500 tactical-grade IMU. EMCORE’s quartz technology enables repeatable high-volume production of precisely machined sensor structures combined with the inherent large signal output and thermal stability of quartz materials. The SDI170 IMU is designed for demanding, mission-critical, rugged environments and ideal for continuous use applications with no wear-out components, highly linear accelerometer performance and longer life compared to competing alternatives. It is constructed with EMCORE’s latest generation quartz gyros, quartz accelerometers, and high-speed signal processing to achieve outstanding precision performance. The solid-state quartz sensors and hermetically sealed IMU construction provide reliable MTBF and a 20-year operating and storage life. Continuous Built-in Test (BIT), configurable communications protocols, electromagnetic interference (EMI) protection and flexible input power compatibility make the SDI170 IMU easy to use in a wide range of higher-order integrated commercial and defense system applications.

Receives vibration signals from an accelerometer installed on the aircraft engine and monitors engine vibration. Processes real-time vibration signals and converts them into IPS AVG units for output. Developed for localization, achieving 50% cost competitiveness compared to equivalent products. - x1 MIL-STD-1553B - x2 UART(RS-422/485) - x2 Accelerometer sensor - Sample rate : Up to 5,000Hz - Size : 220 x 206 x 52 (mm) - Weight : 1.75Kg - Environment : MIL-STD-810G - EMI/EMC : MIL-STD-461G - Power : MIL-STD-704F (28VDC, 10W)

Fast & precise 5-axis exceeds expectations • 15000, 20000 r/min high speed spindle • B-axis/C-axis 0.0001 degree control as standard • Tool change time (C-T-C) 3.8s, 28% faster than previous model • Increased X/Y/Z-axis rapid traverse speed & acc./dec. • Cooling functions as std. on spindle, motor/LM guide/ball screw (X/Y/Z), C-axis table motor • Integrated thermal compensation systems for spindle and structure FURTHER INCREASED MACHINING CAPACITY • Ø630mm dia. 2-axis tilting table, 26% increased compared to previous model • Max. Ø600 x H500mm machining area, 32% increased compared to previous model • Max. 400kg table load capacity with stable table support structure • X/Y/Z axis travel distance 650/520/480mm, up to 20% increased compared to previous model EASY ACCESS, EASIER OPERATION • Easy setup of workpieces with 580mm distance between operator and table center • Easy tool exchange by placing the tool magazine door on the front and applying a tool removal device (Auto Kicking Device) • Improved chip disposal capability with enhanced coolant flood & flushing functions • Grease lubrication system • Compact integrated automation system (AWC)

Electromagnetic activities have become critical in the modern battlespace. In this increasingly contested and congested environment, situational awareness is key in tactical operations. How do you meet such a challenge without compromising the need to remain undetected and to deploy with speed and agility? The solution is passive sensing, sensors that are totally silent and don’t emit signals; but can detect electromagnetic emissions. Passive sensors are nothing new. But, a compact, man-portable system with the ability to support tactical operations at every level, is something new. We call it Sirius Compact, a sensor that can make being silent a very powerful activity.

Presentation by Haigh Farr during the Virtual NH Career Fair, hosted by JobsInNH.

For : Elevator Assembly Tool A320 Project 3.5m (L) x 1.5m (W) x 2m (H )

ELECTROMECHANICAL RELAYS

KMC Series includes high-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments. Space grade/ESA/ESCC qualified are also available.