Interconnect Wire Harness and Cable Assemblies are the connectivity backbone of electronic systems. Fabricated in a factory setting, build-to-print wire harness assemblies enable the OEM manufacturer to reduce the time and expense of in situ interconnection of electronic devices used in complex air, sea, land and space applications.

It is a product produced in Korea and has high performance when used in EO/IR Gimbal for small drones. It can view both VIS and IR images simultaneously and is coupled to a small drone with a small weight to perform operations. Products with manufactured and domestic IR sensors in Korea. we deliver superior technologies that shape the future of defense. Whether supporting ISR missions or enhancing precision in loitering munition operations, MS60 products are designed to ensure operational excellence in the most challenging environments.

CP-10K (FIRE CONTROL COMPUTER) The computer for fixed-rate control consists of five processors for main control, communication, casting, console control, and shared memory, and performs the function of controlling guided missiles through the interface.

Intel® 14th/13th/12th-Gen Core™ 24C/ 32T 35W/ 65W CPU Affordable IP66-rated design for waterproof and dustproof Up to 96GB DDR5 4800 SODIMM -25°C to 70°C wide-temperature fanless operation 3x 2.5Gb and 1x Gb Ethernet ports via M12 X-coded connectors, with 802.3at PoE+ option 1x waterproof USB3.2 Type-C port supporting alternative mode for DisplayPort and USB3.2 dual output 8V to 48V DC input with built-in ignition power control

Communication Antenna for Data and Voice Transmission

This rocket nozzle featuring conformal cooling channels and isogrid ribbing was manufactured using EOS Copper CuCP, a pure copper material optimized for additive manufacturing. The production required approximately 72 hours, taking advantage of the exceptional thermal and electrical conductivity of pure copper to meet demanding aerospace performance requirements. As one of the few companies in Korea capable of performing metal additive manufacturing with pure copper, we provide advanced technical expertise and support OEM production as well as collaborative technology development projects with various industrial partners. The showcased component was designed by nTopology and demonstrates the synergy of advanced design optimization with state-of-the-art copper additive manufacturing.

Designed and suitable for a wide range of missions. It is light and ruggedized and its multi-purpose capability provides freedom of action for the commander in all environments.

DIESTONE DLV is a next-generation cleaning solvent for aerospace and industrial surface preparation. With 70% VOCs, controlled volatility, low odor, and no chlorinated hydrocarbons, it ensures operator comfort and safer workshops. Its high flash point (49 °C / 120.2 °F) reduces fire risks while maintaining powerful cleaning and degreasing performance on metals and composites. Non-corrosive on light alloys, DIESTONE DLV also provides reliable reactivation of epoxy and polyurethane primers before painting, bonding, or sealing. Approved to key aerospace standards, including Boeing BSS 7432 and SAE (ARP1755B, AMS1528, AMS1536), it is trusted by OEMs and MROs worldwide. Available in multiple packaging formats, from bulk containers to pre-saturated wipes, it offers flexibility for both manufacturing and maintenance operations.