R HUGHES' Ca-Zoom PTZ 140 is a Pan-Tilt Zoom Camera inspection equipment equipped with the Ca-Zoom® 6.2 system. This equipment is capable of a total of 432x zoom with 36x optical zoom and 12x digital zoom, increasing inspection efficiency. In addition, two high-performance 35W lights are installed in the light source to enable more smooth inspection. The inspection technology of the PTZ Camera Ca-Zoom® line of products makes them ideal for inspecting large areas that are difficult for humans to access, such as tanks, vessels, pipelines or nuclear power plants.

· Optimized deployment of manned and unmanned aerial assets with separate takeoff and landing runways · Securing aerial/maritime superiority with unmanned combat aerial vehicles (UCAVs) and Drone · Expanded real-time surveillance range through the operation of medium-altitude unmanned reconnaissance aerial vehicles · Enhanced assault capabilities to target and command & control (C2) with manned and unmanned forces

The X-BEAM TECH HXB Connectors, featuring expanded beam technology, hermaphroditic connection, rugged construction for field deployment have been designed for harsh environment applications such as military tactical communications, avionics, offshore systems, outside broadcast, mining and plant.

The expanded beam technology uses expanded and collimated beams to couple optical fibers without any contact. It could allow for optics to be used in areas that have been quite restrictive due to presence of damage or contamination at the fiber end. Hermaphroditic connector design enables fast deployment by daisy-chaining multiple cable segments. HXB series connectors also enable transfer of electrical signal or power using hybrid insert configuration.

The Arizona Aerospace & Defense Supply Chain Directory is a comprehensive, interactive database designed to connect A&D companies with Arizona-based suppliers. The database includes detailed profiles of more than 1,250 companies with a presence in Arizona, and allows users to search by industry, size, certifications and products and services offered.

The maximum transmission distance varies based on the following frequency-related specifications. Camera Frequency Max Cable Length ================ =============== 20 ~ 60 MHz 10 m 60 ~ 80 MHz 7 m 80 ~ 85 MHz 5 m The PoCL Bypass function supports Power over Camera Link (PoCL) operation from the Frame Grabber to the selected camera. However, the power supply to unselected cameras is automatically disabled. To prevent power cutoff, separate power must be provided to the cameras. Configurations are available as follows, including image signal amplification. [Features of CLM-30C4]  Fully supports the Camera Link interface (Area/Line Scan).  Provides manual (switch) or remote (RS232) camera selection.  Allows selection from one of four cameras configured for Base (Layer 1) or Medium/Full (Layer 2) levels.  Supports Base/Medium/Full setups (CC1~4, RS232, LVAL, DVAL, FVAL)  PoCL bypass function: Automatically powers only the selected camera when PoCL-compatible cameras, frame grabbers, and cables are used.  Supports pixel frequency from 20 to 85 MHz.  Supports PoCL signal bypass (patented).  Enables lossless transmission.  Provides additional full-duplex RS232 communication at up to 256 Kbps.  Features a locking DC power jack (Molex).

A compact EO/IR gimbal camera system designed for UAVs, unmanned surface vehicles, and defense platforms. The system integrates a QVGA/VGA-class LWIR thermal imager and a high-resolution EO camera within a stabilized gimbal, ensuring reliable performance in diverse environmental conditions. Optimized for ISR (Intelligence, Surveillance, Reconnaissance) missions, the system provides detection, recognition, and identification (DRI) capabilities with low-SWaP (Size, Weight, and Power) characteristics.

Our firm offers end-to-end GaN production capabilities, including fabrication, packaging, test, and failure analysis to meet custom requirements. To enable customer designs, a process design kit (PDK) is available with a design manual, sample layouts, and a non-linear device model. Options available include fabrication of customer-designed wafers (“PDK foundry service”) or custom design by TransEON and fabrication according to customer specs (“NRE foundry service”). For either option, volume levels available include pilot/engineering runs, multi-project wafers (MPWs), or full production runs.

Specification Array Format : 1280 × 1024 Pixel pitch : 10㎛ Spectral range : 0.9㎛ ~ 1.7㎛ (SWIR) Operability : ≥ 99.5% Quantum Efficiency : 70% @ 1550nm Application Near-infrared Imaging Imaging Spectroscopy Surveillance Medical Science and Biology Astronomy and Scientific Material inspection Food inspection Forgery detection