• Contacts • Backshells / protective caps • Solders sleeves / splices • In-line junctions • Identification labels • Wire terminals

Type : Radial (3P) Size(L,W,H mm) : 193 × 100 × 100 Weight(kg) : 1.7 [Active] N. Speed(rpm) : 3,700 N. Torque(Nm) : 5 N. Power(kW) : 2

RFcore has been innovating MMIC solutions for phased array system pursuing more ease of use, higher performance, higher level of integration as well as lower cost. We believe that the most suitable way is exploiting properties of God gifted semiconductor Silicon and GaN. We aim at integrating all components of TRM for active phased array on single die and even multi-channel TRM too.

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.

The Crane stands as a state-of-the-art Mid-Wave Infrared (MWIR) detector. This device features a 5-megapixel resolution in a 2560×2048 format with a fine 5μm pitch. It is based on SCD's established XBn technology or Hot Full Midwave (HFM) and incorporates a digital readout circuit developed using an advanced CMOS process. The High Operating Temperature (HOT) Focal Plane Array (FPA) functions efficiently at 150K or 120K, enabling a large-format detector that excels in image quality while maintaining a relatively compact size, weight, and power consumption. SCD continues to lead in innovation.

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.

SURI-III is a super multi functioning sight, optimizing firing capabilities for Caliber 50(M2) and AGL(MK19)in the day and night time condition. It could be supported by HMD for User’s shooting position in convenience and for saving Force’s lives. Thermal Camera + Day Camera + LRF + Red Dot Sight + Wireless Goggle + Customized Reticle + Wide Screen presents in One Device

- Capable of manufacturing various types of cable assemblies, including MIL-DTL-38999, D-Sub, and other military-grade connectors - Expertise in both internal and external cable assembly configurations - In-house testing capabilities for electrical characteristics, including insulation resistance, dielectric withstand voltage, and continuity - Equipped with dedicated facilities and specialized equipment for cable assembly production and testing