This Military Field-Grade Uninterruptible Power Supply units are designed for the extreme environmental and demanding electrical conditions of Military/Aerospace applications. This UPS incorporates field proven high efficiency designs and rugged packaging technologies. This UPS units will accept a wide range of input voltage and frequency values while delivering a well-conditioned AC or DC output to the load. The use of lithium ion batteries permits the lowest profile and lowest weight solution in its power class. It is designed and manufactured in SynQor’s USA facilities to comply with a wide range of military standards. Options include two DC outputs, a DC input rated for military 28 VDC sources, and an electronic breaker on the AC output to permit fault-tolerant parallel operation for higher power and/or N+M systems.

For electrical and electronic signal connections inside and outside the hermetic equipment, it reliably protects the device from extreme temperature/humidity changes, vibration and physical/chemical effects, and transmits signals and currents without loss. These connectors use special glass or ceramic as insulation and are used in furnaces, power breakers, submarines, gas control systems, transformer safety devices, etc. Key features of closed connectors: It completely blocks the interior from the outside environment to keep it vacuumed or pressurized. Durability: It works reliably in extreme environments (high temperature, low temperature, humidity, chemicals, etc.). Electrical performance: It delivers electrical signals or power without loss.

Monitors abnormal engine operation based on digital and analog signals from the aircraft engine. It calculates engine life indices and detects engine malfunctions for generate a Pilot Fault List (PFL), which will stored in memory. When an engine failure is detected, it provides warning for display on the Central Maintenance Panel (CMP). Developed as a replacement for obsolete, achieving 60% cost competitiveness compared to equivalent products. - x1 MIL-STD-1553B - x16 Discrete Inout - x14 Discrete Output - x3 Analog Input - x1 RS-232 - Size: 283 x 265 x 89 (mm) - Weight : 4.1Kg - Environment : MIL-STD-810G - EMI/EMC : MIL-STD-461G - Power : MIL-STD-704F (28VDC, 25W)

Sponsored] Raytheon Missiles & Defense, a business of the newly formed Raytheon Technologies, is built on a foundation of advanced innovation and excellence...

Side shells, wing shells and fuselage structures are made of CFK, GFK, aluminium or organic sheets and get connected during production. Sealants are used to seal the connection surfaces. These are usually two-component polysulphides, which have to be applied in different geometries. Typical applications are: Fillet sealings, oversealings, interface sealings and seal caps. Due to their properties, polysulfides require very low pressure and shear handling. The compressibility of the fillers contained in the medium requires a high level of expertise and a coherent overall system from material removal to application. With manual application, long production times and high material ejection have a negative influence on the complete process. Complex quality standards are required due to the risk of human error. With the in-house developments of the vipro-DUOMIX from ViscoTec, this process can be depicted fully automatically. The individual nozzle design is also adapted to each application. The result is a controlled dosage in compliance with the specifications and at the same time the highest repeat accuracy.

GENASYS Ultra high-performance mixed signal test platforms deliver a no compromise functional test solution for satellite, airborne electronics, and other mission critical applications. The scalable architecture supports up to 4500 "any resource to any pin" interface test points and features best-in-class digital performance, with preconfigured Benchtop solutions addressing a broad spectrum of lower channel density applications.

Fast & precise 5-axis exceeds expectations • 15000, 20000 r/min high speed spindle • B-axis/C-axis 0.0001 degree control as standard • Tool change time (C-T-C) 3.8s, 28% faster than previous model • Increased X/Y/Z-axis rapid traverse speed & acc./dec. • Cooling functions as std. on spindle, motor/LM guide/ball screw (X/Y/Z), C-axis table motor • Integrated thermal compensation systems for spindle and structure FURTHER INCREASED MACHINING CAPACITY • Ø630mm dia. 2-axis tilting table, 26% increased compared to previous model • Max. Ø600 x H500mm machining area, 32% increased compared to previous model • Max. 400kg table load capacity with stable table support structure • X/Y/Z axis travel distance 650/520/480mm, up to 20% increased compared to previous model EASY ACCESS, EASIER OPERATION • Easy setup of workpieces with 580mm distance between operator and table center • Easy tool exchange by placing the tool magazine door on the front and applying a tool removal device (Auto Kicking Device) • Improved chip disposal capability with enhanced coolant flood & flushing functions • Grease lubrication system • Compact integrated automation system (AWC)

With a proven track record of innovation, quality and reliability, Microchip continues to evolve as the foremost supplier of semiconductors to the aerospace and defense market. Our rapidly-expanding portfolio of highly-integrated technology supports the most demanding requirements for space, aviation and defense microelectronics. From radiation-hardened, space-grade solutions to advanced military and commercial aviation electronics, we've leveraged our expertise and product knowledge to build applications-based solution platforms that reduce integration risk, improve productivity and speed time to market. - More than 60 years of space flight heritage with products qualified to the highest government, DLA, NASA and ESA standards - Proven innovation, quality and reliability on aerospace platforms over the past 20 years - Legacy of trusted, reliable and cyber-secure supply chain for defense microelectronics