The SCXMC-AURORA is one of Seedcore’s flagship products, designed for high-speed optical data communication through an XMC interface. Utilizing the Xilinx Aurora 64B/66B protocol, it supports four transmit/receive channels, each operating at 10.3125 Gbps via integrated optical transceivers. A device driver program is required for operation, and the Linux driver can be downloaded from the product information page on Seedcore’s website. This module is deployed in the M-SAM air defense system, providing reliable and high-speed data transfer between mission-critical embedded components.

This rocket nozzle featuring conformal cooling channels and isogrid ribbing was manufactured using EOS Copper CuCP, a pure copper material optimized for additive manufacturing. The production required approximately 72 hours, taking advantage of the exceptional thermal and electrical conductivity of pure copper to meet demanding aerospace performance requirements. As one of the few companies in Korea capable of performing metal additive manufacturing with pure copper, we provide advanced technical expertise and support OEM production as well as collaborative technology development projects with various industrial partners. The showcased component was designed by nTopology and demonstrates the synergy of advanced design optimization with state-of-the-art copper additive manufacturing.

We provide advanced Laser-wire Directed Energy Deposition (LW-DED) 3D printing service. Our capabilities include processing various aerospace-grade materials including titanium, niobium, and other specialized alloys, with unlimited scalability for critical aerospace component production and prototyping.

Korean Commander’s Panoramic Sight Specification MODEL: SRBM-1702-60 APPLICATION: K1A1 KCPS SIZE: Φ163.8(I.D)/Φ233.5(O.D)85.6L NO. OF RINGS: 60RINGS TYPE: BORE ROTATING: CW/CCW MASS PRODUCTION ITEM (2009~ )

The RFcore Radar series are FMCW type radar and were developed to detect/track small air targets. The major difference between three models is detection performance. RX32B is fundamental model. RX128B have four times larger radar than RX32B. RX192A have six times larger radar then RX32B. The number of the product name means the number of antenna elements. All have compact and lightweight physical architecture that concentrates all the components required for radar, such as antenna, RF components and radar signal processor, in a small single housing. Transport can be carried in the carrier box and can be easily carried by one person. For installation, you can use a commercially available camera tripod. The weight is about 7.5kg (RX32B) and 15.9kg (RX128B), and the lower connection part is compatible with the tripod connection for the camera. Power supply requires 12VDC (RX32B) and 24VDC power (RX128B and RX192A). When using a battery, it is possible to connect a 12V battery or 24V battery to radars. Usage time may vary depending on the battery capacity. RFCORE recommended the constant power supply. Transfer of Status and BIT information and simple control of the RX32B, RX128B and RX192A are possible with a web browser using the Ethernet connection for authorized users. Using the terminal program provided with the radar, you can view the radar control and detected target information in real time. All RX Radar series’ Power Amp and Core Chip were designed using RFcore's own products.

The NSP-8 is IMSAR’s most powerful radar. It is capable of advanced Synthetic Aperture Radar (SAR), Moving Target Indication (MTI), and Magnitude Change Detection (MCD). When paired with an airborne server, it can even produce SAR Motion Video (SMV). IMSAR adds value to its exceptional engineering with a production time much faster than industry standard. The NSP-8 is designed for durability and thoroughly tested with a Mean Time Before Failure (MTBF) of over 2,000 hours. Additionally, it’s weatherized for optimal performance over land and sea. With this sensor, IMSAR’s users can understand the bigger picture.

ABC leader in test bench has a highly skilled automation service with technicians trained on different PLC platforms and displays from major manufacturers such as SIEMENS, SCHNEIDER, IFM, OMRON, PROFACE, ... The automation engineers are involved in preliminary design to help define customer needs and guide project managers in the possibilities of architecture and machine ...

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.