HPH series is a high density interconnect available up to 303 contacts with multiple hardware choices and backpotting option.With a 0.6mm contact diameter, the HPH Series comes in 3-6 row configurations and is available up to 303 signal contacts on a 1.901mm staggered grid. Contacts are removable for ease of maintenance.

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.

Aviation piston, cylinder, airplane bolts and nuts Tank engine block , Tank nozzle and cover, single wiper driving unit, Balkan parts, composite wrench, 60mm mortar, 4.2inch mortar, 90mm recoiless rifle, 2.75"rocket warhead, 81mm mortar, target for shooting range

The GSG-8 GNSS Simulator is an advanced software-powered turnkey simulator, supporting multi-constellation, multi-frequency, and hundreds of satellite signals. With an incredible 1000 Hz iteration rate, the GSG-8 GPS Simulator is ideal for space trajectories, custom PNT signals, hardware-in-the-loop, and any type of all-in-view satellites simulation. With the GSG-8 Simulator, you can generate RF signals to simulate how your receiver device will react in the real world, under the simulation parameters that you set. Control every aspect of your simulation, including 6 Degrees of Freedom (DoF) receiver trajectories, multi-vehicle simulation, multi-path signals, jamming and spoofing, as well as atmospheric interferences. The GSG-8 is the most popular positioning, navigation, and timing test solution offered through Safran’s GSG family of Skydel-based simulators. It was developed to deliver the highest standard of Global Navigation Satellite System (GNSS) signal testing and sensor simulation performance in an easy to use, upgradable and scalable platform.

The new TAC-450-320/340/360 inertial measurement unit (IMU) is a dependable, tactical-grade, non-ITAR inertial system that’s also affordable. It features EMCORE’s exclusive photonic integrated chip (PIC) technology for robust performance and survivability and offers inertial-grade MEMS accelerometers for outstanding FOG-based inertial performance as affordable as MEMS alternatives. The TAC-450-320/340/360 IMU is ideal for autonomous and unmanned commercial and defense applications, mobile mapping and surveying systems, targeting and pointing systems, and guidance and positioning. Highlights Compact and lightweight with high-performance Offered with 16g inertial-grade MEMS accelerometer Robust performance with high bandwidth Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-320/340/360 IMU provides the safe, accurate performance autonomous platforms demand. State-of-the-art Electronics EMCORE’s Dual Core DSP electronics with ARM processor require less power for extended product life and offer higher speed with integrated multi-channel processing. Low-loss optical circuits use less light for greater efficiency. Feature Options Developer’s Kit for Rapid Integration The FOG/IMU Developer’s Kit includes easy-to-use software that accelerates your IMU and FOG integration, development, and interface efforts.

We overcome industrial barriers even in extreme environments of ultra-high temperatures. VITZROCELL's High-temperature batteries are utilized in extreme environments where high performance is demanded, such as drilling equipment and pipeline inspections.

Sierra Nevada Corporation is a provider of secure computing and communications solutions, enabling high-speed, high-capacity voice, data and video communications for the Department of Defense (DoD) and other mission partners.

The lightest plate carrier of 1.95 lbs Taktic buckle system for quick connect & release Antibacterial/FR treated padded spacer mesh system Poly mesh cummerbund for increased ventilation Flush admin chest pocket with internal elastic straps Rear internal pocket for storage Elastic webbing straps for cable management PALS webbing for MOLLE attachment Removable front flap Zipper for DS Assaulter's Zip-On Back Panels QASM buckle System Plate pocket incorporated 4-way stretch to accommodate multiple plate thickness Composition Material : 500D Cordura® + ARAMID / PV® Size : Small : 8.5" x 11.5" Plate Pocket Medium : 9.3" x 12.3" Plate Pocket Large : 10" x 13" Plate Pocket XLarge : 10.9" x 13.8" Plate Pocket Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)