CPPA Procedure : 1. Requirement Analysis for Customer's parts Purchasing 2. Parts Purchase Negotiations 3. Parts Purchasing Management 4. Component Reliability Testing 5. Space Parts Documentation Support 6. Delivery to the Customer

Model-Based Systems Engineering (MBSE) is a methodology that integrates design, analysis, and verification activities throughout the system lifecycle using architecture models. By modeling requirements, functions, structure, and behavior, MBSE supports consistent and informed decision-making. Ansys SAM (System Architecture Modeler) supports the latest system modeling language, SysML v2, and enables both graphical and textual modeling, real-time collaboration, and model management. Ansys ModelCenter integrates various engineering tools and builds automated workflows, enabling what-if simulations and trade studies. By connecting architecture models with simulation models, it supports consistent design analysis and requirements validation using a single source of truth (ASoT).

Microchip Technology Incorporated is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs, which reduce risk while lowering total system cost and time to market. The company's solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. Welcome to Microchip, we hope to partner with you on a future project. We believe together we can accomplish anything.

A connector in military or aerospace applications is a device used to join electrical wires, cables, or circuits securely, ensuring reliable signal and power transmission under harsh conditions.

- Reduced weight and manufacturing cost by more than 30% compared to conventional metallic propellant tanks - Designed and qualified to according KARI requirements - Proof & burst pressure application - Cyclic pressure(MEOP, Max. Enveloped Operating Pressure) application, more than 40 cycles

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.

1. Ultra-high Performance LED Searchlight (53,000lm+ max) - Designed with heat sink optimization via thermal analysis for extended illumination. 2. Powerful Broadcasting System (100dB) 3. AI Algorithm for Automatic Object Recognition and Tracking based on Jetson Platform 4. Equipped with EO/IR Cameras for All-Weather Surveillance and Precise Target Identification 5. Hybrid Wired/Wireless System for Enhanced Flight Endurance: Wired Power System, Automatic Wired Detachment Module

To reduce aircraft development lead-time, Safran Engineering Services is specialized in quick design and engineering in full autonomy. Teams provide global loads for ground and flight maneuvers, follows the evolution of weight and center of gravity for aircraft components and support sales campaigns with weight & balance evaluation.