For : Elevator Assembly Tool A320 Project 3.5m (L) x 1.5m (W) x 2m (H )

Raytheon Intelligence & Space's ISTAR is a multi-intelligence aircraft that uses artificial intelligence, integrated onboard sensors and advanced processing to provide critical information to military and civilian air and ground crews. Our integrated suite of ISR solutions provide state-of-the-art capabilities for national defense missions.

Antibacterial/FR treated padded spacer mesh system Poly mesh cummerbund for increased ventilation XFrame® Dynamic Load Carrige® compatible Compatible with our entire accessories line Flush admin chest pocket with internal elastic straps PALS webbing for MOLLE attachment Zipper for Assaulter's Zip-On Back Panels QASM buckle system Holds up to five 5.56mm magazines Internal plate pocket retention straps accommodate several different plate thickness Soft armor included Composition Material: 500D Cordura® + ARAMID/PV® Size : Small / Medium : 8.5" x 11.5” -9.3" x 12.3" Plate Pocket Front Panel Area of Coverage : Length 13.25” Width 11" Large / XLarge : 10" x 13"- 10.9" x 13.8” Plate Pocket Front Panel Area of Coverage : Length 15" Width 12" Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)

Communication Antenna for Data and Voice Transmission

Our product range includes caps, chains, adapters, and locknuts, all manufactured through advanced CNC machining to ensure long-lasting performance even under frequent assembly and disassembly. These accessories are widely applied in electronics, aerospace & defense, and medical devices, where durability and reliability are critical. With the ability to provide customized designs and precision machining, we guarantee consistent quality, fast delivery, and compatibility with international standards, earning long-term trust from global clients.

LW-DED 3D printing head module for Morphing Shield Technology. Morphing Shield Technology builds aportable inert gas enviroment surrounding the melting zone for laser wire DED Process.

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.

The SBC3612D is a rugged 3U VPX single board computer aligned with the compute-intensive SOSA profile, delivering high-performance processing with the Intel® Xeon® D-2775TE 16-core processor and flexible expansion capabilities. • Supports up to 64GB DDR4 SDRAM and 480GB NAND Flash (NVMe SSD) • Offers 100GbE and 10/25GbE data plane and control plane support • Features the Xilinx® Zynq® UltraScale+™ MPSoC FPGA for enhanced security