Our technology and quality have been recognized internationally and regionally as we supply products manufactured based on AS9100, NADCAP special process approval to global companies lockage in domestic and overseas.

Kia developed Granbird Bare Chassis Vehicle based on long-accumulated technology and infrastructure for commercial vehicles. This Granbird Bare Chassis vehicle can be easily modified as specialized vehicles on the basis of diverse customer requirements.

OZVPX3-410 is Olzetek's flagship 3U product. Olzetek's 3U Platform Family has maximum scalability using Xilinx Zynq® UltraScale +MPSoC, which is capable of a high-performance Arm®-based multi-core and multi-processing system, as well as video signal/packet processing functions, graphics and video pipelines. This is a SoC product designed to meet challenging demands by offloading essential applications to dedicated processing blocks and supporting major peripherals and interfaces. The OZVPX3-410 product is an ideal solution that can be applied to applications requiring Analog Video (PAL/NTSC) encoding and decoding and includes customization options (consignment development) according to specific video inputs, requirements analysis, and design. We also provide consignment development of a complete Video 3U Platform.

The Defence Technological and Industrial Bases is indispensable for maintaining peace and security. After all, it provides an armed force with services and equipment. If it does not, the armed forces are left hobbled. This also applies to the Dutch armed forces. Nevertheless, the defence and security sector is experiencing difficulties in accessing private finance. Referring to Environmental, Social and Governance (ESG) criteria, companies in the sector would not be able to access private financing from pension institutions, insurers and financial service providers. Because of the same criteria, the sector is experiencing difficulties in opening accounts with private banks. Below is summary on the current state of the issue.

1. Maintenance • Depot Maintenance • Structure & Avionics Replacement, Repair, Wire Harness, Test and Inspection 2. Upgrade & Modification • Structure Upgrade and Modification • Avionics Upgrade, System Integration, Test and Inspection Highlights √ Final Assembly incl. Engine Installation √ System Integration, Test & Inspection Project Highlight : KT-100 & Light Sport Aircraft (Final Assembly), HH-60, CH-53, CH-47, F-16, P3-c, C-130H, AS-1S, MD500, NG RQ-4B ( Logistic & Ground Support)

The A-C series is the most lightweight and low profile altitude switch in the Precision Sensors product line. The capsule based sensing element provides repeatable and precise absolute pressure threshold detection by sensing changes in the ambient air pressure compared to an evacuated capsule. The skeletal construction removes the need for bulky pressure fittings.

Typical uses include aircraft cabin air pressure monitoring.

For an environmentally sealed alternative, refer to the E-C series. For qualification information, please consult the sales or engineering departments.

Features

Intended for gaseous media
Low profile skeletal design
Ni-Span-C capsule provides superior setpoint stability over temperature
Custom configurations available upon request

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

Hermetic connectors are a special class of sealed Mil /Aero interconnect that incorporates glass-to-metal or other highly-engineered sealing technology. Hermetic seal connectors are specified for applications as divergent as submarines and orbiting satellites. They are deployed to resist moisture ingress in underground applications and to withstand pressure differentials in vacuum chambers, laboratory equipment and commercial and military aircraft. Hermetic seal connectors, such as the MIL-DTL-38999 Series I, II, III and IV supplied by Glenair, are principally designed for use in military aerospace — in fact, the sealing requirement for connector hermeticity was originally driven by military electronic applications. But the products are equally at home in commercial applications such as oil-patch, logging equipment or medical devices.