Safran Engineering Services was selected by Honeywell for the STC development for multiple rotorcrafts. Safran Engineering Services took responsibility as the design authority for the design, development, integration, installation, testing, tech pubs and STC approval under FAA, EASA and TC agencies.

The AB-M1300 is a 1.3 ton-class eVTOL AAM. With a wingspan of 10 meters, the AB- M1300 is a crewed–uncrewed hybrid aircraft aiming for commercialization in 2028. Falling under the Light Sport Aircraft (LSA) certification category, it can carry up to two occupants, reach a maximum speed of 400 km/h, operate for two hour of flight time, has a maximum take-off weight (MTOW) of 1.3 tons, and a payload capacity of 250 kg. The AB-M1300 is designed for a variety of missions, including mid-mile logistics, personal leisure use, and pilot training.

The new TAC-450-320/340/360 inertial measurement unit (IMU) is a dependable, tactical-grade, non-ITAR inertial system that’s also affordable. It features EMCORE’s exclusive photonic integrated chip (PIC) technology for robust performance and survivability and offers inertial-grade MEMS accelerometers for outstanding FOG-based inertial performance as affordable as MEMS alternatives. The TAC-450-320/340/360 IMU is ideal for autonomous and unmanned commercial and defense applications, mobile mapping and surveying systems, targeting and pointing systems, and guidance and positioning. Highlights Compact and lightweight with high-performance Offered with 16g inertial-grade MEMS accelerometer Robust performance with high bandwidth Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-320/340/360 IMU provides the safe, accurate performance autonomous platforms demand. State-of-the-art Electronics EMCORE’s Dual Core DSP electronics with ARM processor require less power for extended product life and offer higher speed with integrated multi-channel processing. Low-loss optical circuits use less light for greater efficiency. Feature Options Developer’s Kit for Rapid Integration The FOG/IMU Developer’s Kit includes easy-to-use software that accelerates your IMU and FOG integration, development, and interface efforts.

BERNIER designed the CMASD line specially for harsh environments. This line presents the same apreciated characteristics than the CMA connectors in a smaller shell in which can be set up to 8 contacts. Its ergonomics and toughness enhances headsets and handsets use and its construction allows high speed data communication. . Applications RADIOS – ACCESSORIES – INTERCOMS – CRYPTED DATA – OPTRONIC DEVICES – WEAPON SYSTEMS – RUGGED COMPUTERS – TACTICAL EQUIPEMENTS

- Comprehensive High-Frequency Electromagnetic Simulation - Analysis of ships, submarines, aircraft, fighter jets, and satellites including antennas - EMC and EMP analysis including cables - Radome and multi-antenna interference analysis - Wireless coverage, network planning, and spectrum management

The GRA117S is a rugged 3U VPX SOSA-aligned video graphics and GPGPU card delivering high-performance AI and graphics with the NVIDIA RTX™ 5000 and PCIe Gen-4 connectivity. • NVIDIA RTX™ 5000 (Ada Lovelace) GPU: 16 GB GDDR6 ECC, 9,728 CUDA/76 RT/304 Tensor Cores • PCIe Gen-4 interface, AV1/H.264/H.265 codecs, GPUDirect RDMA • Rugged design: conformal coating, air- & conduction-cooled, −40–71 °C range • SOSA slot profiles 14.6.11 & 14.6.13 compliant • Windows/Linux drivers, CUDA/CUDA-X/OpenCL support

Understand the Export Process to start selling to global customers. Are You Export Ready? Take an assessment. The U.S. Commercial Service has developed comprehensive video collections that will help your small business become better equipped to enter the exciting exporting world.

The extended range of products offered through AMA is also reflected in the range of services provided. Each company has its own processing capabilities which vary from business to business. In essence, the collective capability of AMA embodies the latest technology to meet the needs of any specific metal processing requirement, including but not limited to: Cutting shape cutting milling surfacing sawing drilling guillotining waterjet cutting USI testing heat-treating or re-tempering forgings machining to near net shape