RFcore has been innovating MMIC solutions for phased array system pursuing more ease of use, higher performance, higher level of integration as well as lower cost. We believe that the most suitable way is exploiting properties of God gifted semiconductor Silicon and GaN. We aim at integrating all components of TRM for active phased array on single die and even multi-channel TRM too.

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.

To reduce aircraft development lead-time, Safran Engineering Services is specialized in quick design and engineering in full autonomy. Teams provide global loads for ground and flight maneuvers, follows the evolution of weight and center of gravity for aircraft components and support sales campaigns with weight & balance evaluation.

The SDT F 16 Combat Training Pod is mounted on F-16 and similar air platforms in an external pod, and ensures efficiency in exercises and in the provision of air-to-air and air-to-ground tactics training to pilots. SDT F - 16 Combat Training Pod features advanced air-to-air and air-to-ground combat training capabilities, such as real-time autonomous position generation, weapon simulation and real-time hit/miss notification, thanks to its long-range and high-speed RF data link and integrated processors. The system has mission planning, live monitoring, debriefing and analysis/evaluation features. The SDT F 16 Combat Training Pod enables training in real flight conditions and in multi-threat/target environments. Its high-speed data link and modular design mean that the System is also a Live-Virtual-Constructive (LVC) training infrastructure.

High density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. The HDLP series meets the requirement of space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance.

Current list of Lockheed Martin products.

This KF-21 fighter jet model is produced using advanced SLA (Stereolithography) additive manufacturing technology, providing both intricate detail and structural precision. Manufactured with industrial-grade ABS material, the model benefits from our fleet of six SLA machines, ensuring consistent quality and scalability for various production demands. Our in-house post-processing team delivers a wide range of finishing options, including custom color applications tailored to client specifications. Our company’s origins are rooted in expert prototype fabrication, and we have since evolved into a leader in additive manufacturing technologies. We support OEM production and prototype mock-up projects for diverse clients, building a reputation for technical excellence and collaborative development. The KF-21 model highlights our capabilities in precision model making, turning innovative designs into high-quality finished products.

The NIDV supports its members in both the national and international markets in as many ways as possible. From participation in international projects, international trade fair visits to programs with government support. You can find more information about these initiatives below. International projects The NIDV organizes various opportunities for its participants to improve their international opportunities. The NIDV facilitates international trade fair participation, matchmaking events with international Original Equipment Manufacturers (OEMs) and meetings about international opportunities. Trade fairs and trade missions Participation in trade fairs takes place in close consultation and collaboration with a number of departments. The Ministries of Foreign Affairs, Defense and Economic Affairs are involved in the activities. For the government part, the RVO is involved in the creation of the Dutch pavilion and hospitality lounge with the help of the Ministry of Economic Affairs and Climate Policy. In addition to trade fairs and trade missions, the NIDV actively participates in various international projects. Partners for International Business (PIB) Partners for International Business (PIB) is a program that allows Dutch companies to realize their international ambitions in a public-private partnership. Doing business abroad is not always easy. You may encounter trade barriers, insufficient knowledge among local governments and companies, or adverse local legislation. Collaborating with other companies in the sector and the Dutch government can ensure that you are in a stronger position. Alliance II The NIDV will participate in EU-ALLIANCE II from 2021 to 2023, this European project aims to support SMEs on the international market in the field of technical textiles, connectivity and advanced materials on “dual use” markets in four target countries , namely: United States, Canada, Japan and Indonesia.