Twister is lightweight, rapidly deployable, and designed to provide actionable intelligence directly at the point of contact. Its agility and intuitive operation make it ideal for SOF units operating in contested or high-tempo environments. Key Features: Lightweight and packable <1-minute deployment Designed for small-unit autonomy Live video and metadata transmission Supports target acquisition and real-time threat detection

Our broad alloy portfolio enables customers to achieve higher efficiencies, reduce pollution levels, extend product life, and reduce costs. Our corrosion-resistant alloys are generally distinguished by the HASTELLOY® brand and our high-temperature family of alloys are generally distinguished by the brand.

Mixed Signal Oscilloscope (4) Analog Channels, 10M record length, Certificate of Traceable Calibration Standard

Leveraging industry’s leading MEMS technology to provide previously unheard of capabilities in angle random walk values (0.02°/√hr.) without loss of tactical grade levels across military environments, including 1°/hr. bias stability, the SDI500 is designed to achieve the demanding performance levels required in sophisticated systems applications. It is particularly suited for use by Integrators and OEMs, packaged in a highly miniaturized, cylindrical configuration with a volume of only 19 cubic inches. Boasting a 20-Year lifetime capability without requiring calibration and a MTBF of more than 100,000 hours, multiple output data formats and SDLC, RS232 and UART output interfaces are provided in this revolutionary IMU for optimized systems protocols.

Receives vibration signals from an accelerometer installed on the aircraft engine and monitors engine vibration. Processes real-time vibration signals and converts them into IPS AVG units for output. Developed for localization, achieving 50% cost competitiveness compared to equivalent products. - x1 MIL-STD-1553B - x2 UART(RS-422/485) - x2 Accelerometer sensor - Sample rate : Up to 5,000Hz - Size : 220 x 206 x 52 (mm) - Weight : 1.75Kg - Environment : MIL-STD-810G - EMI/EMC : MIL-STD-461G - Power : MIL-STD-704F (28VDC, 10W)

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.

No Coding Required: Create XR content effortlessly with a drag-and-drop interface. Industry-Specific Solutions: Suitable for manufacturing, logistics, energy, and various industries. Multi-Device Compatibility: Works on PCs, tablets, smartphones, and smart glasses (VisionX). Real-Time Collaboration: Multiple users can edit and share content simultaneously.

The extended range of products offered through AMA is also reflected in the range of services provided. Each company has its own processing capabilities which vary from business to business. In essence, the collective capability of AMA embodies the latest technology to meet the needs of any specific metal processing requirement, including but not limited to: Cutting shape cutting milling surfacing sawing drilling guillotining waterjet cutting USI testing heat-treating or re-tempering forgings machining to near net shape