The SCXMC-HDLC card operates through the XMC interface of the SBC and provides real-time communication for control and status data based on synchronization signals. It supports serial communication via the SBCRTM’s Micro D-sub 37-pin connector using a standard D-sub 9-pin interface, allowing long-distance transmission through LVDS signaling. With four transmit/receive channels, it achieves 1–8 Mbps per channel and delivers low-latency performance of less than 40 µs for real-time operations. A device driver program is required for operation, and the Linux driver can be downloaded from Seedcore’s product page. Drivers for other operating systems can be developed upon request. This module is deployed in the L-SAM multi-function radar system, enabling fast and reliable control data communication across mission-critical components.

We have taken the standard housing configuration of the P1 & P3 mounting dimensions while incorporating true differential pair contacts within the P1 & P3 dimensional constraints. P1 connector housing contains 21 position true differential pair blind mate contacts allowing board designers to carry high density differential pair signals from the LRU via motherboard to daughter-card plug in modules with a single connector P1 type housing.

Best selling item in FS Flexible Input Voltage: 24V Improved Innovative noise and vibration Flexibility of target temperature: 55K, 80K, 110K, 130K Possibility adjusted for custom's requirements Used in various industrial fields of Defense and Commercial

Spring probes provide reliable electro-mechanical performance through hundreds of thousands of cycles. They are available in a variety of sizes, spring forces and terminations. Smiths Interconnect compression mount connectors utilizing spring probe technology offer tremendous advantages in reliability, performance and efficiency in comparison to conventional technologies like stamped metal, wire mesh, pin-and-socket or elastomer. Standard spring probes offering includes battery contact and connector probes designed to optimize contact performance in high-reliability, multiple-cycle interconnect applications.

Moog designs and integrates highly innovative steering solutions that enable the precise accuracy of the world's best tactical missiles, guided projectiles and launch platforms. Having produced and delivered well over one million systems for dozens of high profile platforms, customers appreciate our operational excellence value proposition: 100% quality delivered 100% on-time.

Aviation electrical system services As Korea's largest and most advanced wire harness and cable assembly manufacturer, Huneed Technologies produces simple to highly complex wire harness and electrical panel assemblies for global OEMs. Huneed Technologies provides cost-effective solutions for aviation electrical systems requirements and specializes in a wide range of low-volume production lines. With state-of-the-art equipment capable of laser wire marking, Huneed Technologies ensures high quality and cost competitiveness for system control, electrical conduction, testing and support for numerous aircraft and equipment platforms. Huneed Technologies provides Built-to-Print service that meets specifications for products of any size.

We provide advanced Laser-wire Directed Energy Deposition (LW-DED) 3D printing service. Our capabilities include processing various aerospace-grade materials including titanium, niobium, and other specialized alloys, with unlimited scalability for critical aerospace component production and prototyping.

Silicon Carbide Products Used in Semiconductor Etching Processes