In addition to honeycomb potting, sandwich components often also have to be sealed and thus reinforced in the edge areas. For this purpose, similar or even identical filling materials are used as those used for filling the honeycombs themselves. Namely, core and edge filling compounds with very low density, which is achieved by enriching the material with hollow spheres. With our dosing technology, this process can also be automated. The 1-component or 2-component materials are processed gently – without changing their material properties. The material application can be fully automated or semi-automated. Thanks to pulsation-free dispensing, the best results can be achieved with the minimum of effort. This allows you to reduce production times while optimizing production processes at the same time.

ELECTROMECHANICAL RELAYS

The SDT F 16 Combat Training Pod is mounted on F-16 and similar air platforms in an external pod, and ensures efficiency in exercises and in the provision of air-to-air and air-to-ground tactics training to pilots. SDT F - 16 Combat Training Pod features advanced air-to-air and air-to-ground combat training capabilities, such as real-time autonomous position generation, weapon simulation and real-time hit/miss notification, thanks to its long-range and high-speed RF data link and integrated processors. The system has mission planning, live monitoring, debriefing and analysis/evaluation features. The SDT F 16 Combat Training Pod enables training in real flight conditions and in multi-threat/target environments. Its high-speed data link and modular design mean that the System is also a Live-Virtual-Constructive (LVC) training infrastructure.

A device that integrates and displays comprehensive navigation information for submarines, enabling operators to control various navigation sensors and systems while supporting mission execution. - Compliant with MIL-SPEC standards (shock, vibration, temperature/humidity, EMI/EMC) - Mechanically engineered design for improved maintainability

P18M Pressure switch

· Based on proven KSS-III submarine, highly reliable platform · Full lithium-ion battery system with over 7 days submerged endurance without snorkeling · Integrating X-rudder configuration to enhance maneuverability and control performance · Dedicated SOF Lockout Trunk optimized for special force operations with inflatable boats, engines and gears for all SOFs

[Cutting by water jet] Micro water jet cutting: The micro water jet enables a refined process to be carried out in precision cutting. This high-precision technology reduces the jet diameter by a factor of 5 and makes water jet cutting more precise by a factor of 10. The micro water jet achieves a cutting accuracy of +/- 0.01 mm and a positioning accuracy of ±0.005 mm. The proven advantages of the cold cutting process remain unchanged. In the pure water process, the cutting width was reduced to 0.2 mm in the abrasive process for hard materials such as nickel-based alloys and titanium. The new technology controls the cutting process and manipulates the cutting path depending on the contour and speed enabling a highly precise cut. Standard waterjet cutting: Water jet cutting is highly efficient and at the same time less severe than other cutting techniques. Low process forces and thermal loads prevent bending or melting. We can cut filigree delicate contours from practically all nickel alloys and titanium alloys. Using our standard process we can cut a range of shapes and dimensions according to customer requirements and drawings and achieve tolerances of +/- 0.1 mm or +/- 0.2 mm.

The Glenair next-generation STAR-PAN NG ecosystem incorporates a range of new capabilities in direct response to requests from JTACs, special operations forces, mission commanders, and other military specialists. Design innovations in STAR-PAN NG have resulted in higher current-carrying capabilities, greater versatility in power input support, and real-time plug-and-play USB device integration. The STAR-PAN NG hub and cable series offers a number of interface improvements and circuit board innovation.