This Ka-band antenna and data transmission device incorporates electronic beam steering antenna technology and software-defined radio technology as part of the Ka-band downlink system for satellites. It serves as a key component of data downlink systems within the satellite payload, supporting high-speed data transmission. The device enables system optimization through miniaturization, lightweight design, and single-unit modularization.

공중 통신용 VHF/UHF 트랜시버 제품군 R&S®M3AR 제품군의 소프트웨어 정의, 다중 대역 지원 공중 트랜시버는 모듈식 설계와 첨단 기술로 높은 MTBF 값과 긴 수명을 제공합니다. 작고 가벼운 이 트랜시버는 뛰어난 성능으로 무인 항공기를 포함한 모든 유형의 항공기에서 작동할 수 있습니다. 언제든지 다른 파형을 설치해 사용할 수 있어 다양한 작전 시나리오에서 상호 호환이 가능합니다.

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

We are one of the world's leading manufacturers of both military and commercial aircraft ground support equipment. Hydraulics International, Inc. is proud to be one of a few small companies having the total self sufficiency in the design and fabrication of aerospace ground support equipment.

Side shells, wing shells and fuselage structures are made of CFK, GFK, aluminium or organic sheets and get connected during production. Sealants are used to seal the connection surfaces. These are usually two-component polysulphides, which have to be applied in different geometries. Typical applications are: Fillet sealings, oversealings, interface sealings and seal caps. Due to their properties, polysulfides require very low pressure and shear handling. The compressibility of the fillers contained in the medium requires a high level of expertise and a coherent overall system from material removal to application. With manual application, long production times and high material ejection have a negative influence on the complete process. Complex quality standards are required due to the risk of human error. With the in-house developments of the vipro-DUOMIX from ViscoTec, this process can be depicted fully automatically. The individual nozzle design is also adapted to each application. The result is a controlled dosage in compliance with the specifications and at the same time the highest repeat accuracy.

NVIDIA IGX is a cutting-edge AI platform delivering high-performance, secure, and reliable computing. Built on autonomous-driving expertise, it supports industrial automation and medical devices, with PCIe expansion for extra vision inputs and full-stack enterprise-grade software and long-term support.

Dual function pressure and temperature transducer

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