Threaded bushing enables localized reinforcement of and attachment to panel structure. Supplied with disposable installation fixture. 1.25" Flange Diameter. SIZES: Imperial fine thread sizes from 10-32 (.190"-32) to 3/8-24 (.375"-24), Imperial coarse thread sizes from 8-32 (.164"-32) to 3/8-16 (.375"-16), and metric thread sizes from M5 to M8. 1.25" Flange Diameter. Grip lengths from 0.25" to 1.50". MATERIALS: Aluminum, 300 Series Stainless Steel, A-286 Stainless Steel, 316 Stainless Steel, and Titanium. Optional epoxy primer. FEATURES: Standard 1.25" diameter flange, 0.75" x 1.25" trimmed flange optional.

High-Reliability Space-grade SRAM memory : 1. Density : 16Mbit (512k x 32bit) SRAM 2. Package Type : 100 Pin CQFP (Ceramic Quad Flat Package) 3. MIL-PRF-38535 Class V Qualified 4. Operating Temperature : -40℃ ~ +125℃ 5. Radiation : TID > 102 krad, SEL LETth > 80.4MeVcm2/mg@ 85℃

By affiliating with asahi-Kasei EMD in 1999 recognized as a greatest electronic and chemistry company in Japan, we have been supplied Master roll by Asahi-kasei and that allowed us to meet our customer's needs from the time our company was established. We supply not only household products but also high technology semiconductor package products for domestic market.

Type : Radial (3P) Size(Ø, mm) : 152 × 106 Weight(kg) : 5.1 N. Speed(rpm) : 2000 N. Torque(Nm) : 55 N. Power(kW) : 11.5

Side shells, wing shells and fuselage structures are made of CFK, GFK, aluminium or organic sheets and get connected during production. Sealants are used to seal the connection surfaces. These are usually two-component polysulphides, which have to be applied in different geometries. Typical applications are: Fillet sealings, oversealings, interface sealings and seal caps. Due to their properties, polysulfides require very low pressure and shear handling. The compressibility of the fillers contained in the medium requires a high level of expertise and a coherent overall system from material removal to application. With manual application, long production times and high material ejection have a negative influence on the complete process. Complex quality standards are required due to the risk of human error. With the in-house developments of the vipro-DUOMIX from ViscoTec, this process can be depicted fully automatically. The individual nozzle design is also adapted to each application. The result is a controlled dosage in compliance with the specifications and at the same time the highest repeat accuracy.

The NSP-5 is an all-weather, multimode, Ku-band radar designed to fly on Group 3-4 Unmanned Airborne Systems (UAS). Its low-Size, Weight, and Power (SWaP) design means ample room for other onboard sensors, such as Electro-Optical and Infrared (EO/IR) cameras. This means users can understand the bigger picture. The NSP-5 is capable of performing spot and stripmap Synthetic Aperture Radar (SAR) and Magnitude Change Detection (MCD), as well as Moving Target Indication (MTI) collections in a variety of maritime and land environments in all weather conditions. This includes smoke, fog and other obscurations where the operators do not have a clear view of the terrain below them. The NSP-5 has a proven track record of reliability and has a recommended maintenance interval of 2,000 hours. Additionally, the modular design makes the NSP-5 easy to integrate onto most platforms.

CPPA Procedure : 1. Requirement Analysis for Customer's parts Purchasing 2. Parts Purchase Negotiations 3. Parts Purchasing Management 4. Component Reliability Testing 5. Space Parts Documentation Support 6. Delivery to the Customer

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.