Brazing is bonding two or more pieces of metal by means of flowing a filler metal between the joint interfaces at a temperature below the melting point of the base metal. The filler metal, upon cooling to the solid state, forms a strong metallic bond throughout the joined area. Through Dip-Brazing, RF Systems manufacture 1. Brazed Antennas 2. Brazed Waveguides 3. Brazed Divider / Combiner

Consists of a Data Transmission and Recording Unit (DTRU) for data transmission and collection, and a Removable Mass Memory (RMM) for data storage. Stores pre-planned flight mission data in the RMM on the ground and transmits it to the aircraft via the DTRU. Collects various mission data (flight data, monitoring data, video data, and audio data) during flight, stores it in the RMM, and transmits it to the ground for mission analysis. - x5 ARINC-818 Recording as H.264 - x2 Analog audio recording - x7 MIL-STD-1553B Bus Monitoring - x2 Gigabit Ethernet Monitoring - 512GB Solid-State Disk (up to 2TB) - Size : 160.1x146.0x232.4 mm - Weight : 4.25Kg - Power : MIL-STD-704F (28VDC, 58W) - Environment: MIL-STD-810G - EMI/EMC: MIL-STD-461G

Designed with durability in mind, the SG20BL is equipped with a robust M8 circular connector, hardened steel gears and an impressive IP-68 rating, ensuring it can withstand harsh environmental conditions while maintaining optimal performance. With a Mean To Time Failure (MTTF) of greater than 1,000 hours, users can trust our servo to deliver consistent functionality throughout its operational lifespan. Available in both a 12V and 24V model with wide operating voltages of 9-15V and 18-32V, respectively, the SG20BL also features an ultra-efficient brushless motor delivering exceptional power-to-weight ratio and a contactless magnetic encoder offering enhanced responsiveness. The implementation of CAN 2.0A,B / DroneCAN command protocols further streamlines communication and integration with advanced unmanned systems. #UAV #UAS #UGV #UUV #USV

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.

Safran’s TG600 is a 600 kW hybrid-electric turbogenerator—derived from the Arrano turboshaft and paired with GENeUS generators—designed to serve as the core propulsion component for Electra’s nine‑passenger eSTOL aircraft.

Drone Hunter FD is a powerful countermeasure against drone threats. Designed to cover ISM bands and GNSS L1 , L2, L5 it effectively neutralizes a single drone or multiple drones approaching in a direction from a distance of 5km and operating within its antenna beam width. It is equipped with high-power amplifiers and signal generators to enable powerful multi-band continuous jamming. This field-proven solution operates with a positioner that receives data from a seamlessly integrated detection/identification system by OURANOSTM C2 or third-party systems. In addition, it can be used as a stationary/mobile solution.

The SC-SBCRTM-V2 is a Rear Transition Module (RTM) designed to extend the I/O functionality of the SBC6511 single-board computer. Mounted on the rear side of the main VPX backplane, this module provides additional I/O expansion through Micro-D and D-sub connectors for synchronization signals, two Ethernet ports, two Mini-DisplayPort video outputs, two USB interfaces, and MMCX connectors. It enhances system flexibility and connectivity for embedded and radar signal-processing applications.

With a proven track record of innovation, quality and reliability, Microchip continues to evolve as the foremost supplier of semiconductors to the aerospace and defense market. Our rapidly-expanding portfolio of highly-integrated technology supports the most demanding requirements for space, aviation and defense microelectronics. From radiation-hardened, space-grade solutions to advanced military and commercial aviation electronics, we've leveraged our expertise and product knowledge to build applications-based solution platforms that reduce integration risk, improve productivity and speed time to market. - More than 60 years of space flight heritage with products qualified to the highest government, DLA, NASA and ESA standards - Proven innovation, quality and reliability on aerospace platforms over the past 20 years - Legacy of trusted, reliable and cyber-secure supply chain for defense microelectronics