KMC Series includes high-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments. Space grade/ESA/ESCC qualified are also available.

Every year, we celebrate World Space Week in October to honor scientists' contributions to space research and inspire the next generation of innovators. Honeywell has been a part of every NASA human space mission since the late 1950s, when our flight-control systems were installed on the X-15 Rocket Plane (shown above in a photo of Neil Armstrong after a research flight in November 1959).

Our firm offers end-to-end GaN production capabilities, including fabrication, packaging, test, and failure analysis to meet custom requirements. To enable customer designs, a process design kit (PDK) is available with a design manual, sample layouts, and a non-linear device model. Options available include fabrication of customer-designed wafers (“PDK foundry service”) or custom design by TransEON and fabrication according to customer specs (“NRE foundry service”). For either option, volume levels available include pilot/engineering runs, multi-project wafers (MPWs), or full production runs.

Every Partnership Pavilion is staffed by an experienced event team. Whether it’s coordinating with the show organizer; providing technical support; assisting with contractors, catering, or translators; or tracking a shipment, Team Kallman will help.

Dual Narrow Linewidth Amplifier - 3kW per channel

The HPD/HPF PCB Connectors series is crafted with precision, integrating advanced Hypertac contact technology for dependable connectivity. With a lifespan of up to 100,000 insertion/extraction cycles, these connectors ensure consistent performance in challenging environments. They feature optimized power efficiency and strong high-current handling capabilities, enhancing system efficiency while maintaining reliability. Engineered to withstand tough conditions, these connectors offer robust connectivity solutions across various applications, promoting seamless operation, productivity, and long-term dependability for your systems.

Low Size, Weight and Power (SWaP) at only 297g. Up to 100 TOPS GPU by NVIDIA® Jetson Orin™ NX Supports multiple camera and sensor interfaces 2x GbE and 2x USB3 for RGB/ Infrared/ hyperspectral cameras and lidar/ radar 2x GMSL2 for HDR/ 3D cameras Built-in UART and CAN to interact with flight controller 1x M.2 2230 for storage and 4G/5G communication ready Supports 4S-14S drone battery pack Compatible GMSL2 cameras with pre-built drivers

SAIT CIRUS has been fortunate to receive generous funding from the Canada Foundation for Innovation (CFI), Natural Sciences and Engineering Research Council of Canada (NSERC), and Prairies Canada to support the development of our research centre and supporting applied research projects. Our research centre features a diverse and advanced fleet of remotely piloted aircraft, sensors, survey equipment, data processing and modeling software, and hardware. Some of our remotely piloted systems are the only ones in North America, making CIRUS a leading research centre on the continent.